Sustainable manufacturing of high-quality compound semiconductor wafers

A PhD student is sought to undertake a project jointly funded by the University of Strathclyde. The project aims to research a novel laser-based manufacturing approach and its testbed for yielding sustainable and high-volume manufacturing of high-quality next-gen semiconductor wafers.

The PhD studentship will be 3 years, covering home fees and standard stipend. To be considered for the role, you will be educated to a minimum of 2:1 or equivalent in an appropriate discipline, or have significant relevant experience in addition to a relevant degree.

This project aims to research, create and demonstrate a novel hybrid high-speed laser slicing approach and its testbed for yielding sustainable and high-volume manufacturing of high-quality next-gen semiconductor wafers in a broad range of WBG materials (such as SiC, GaN, ZnO, diamond, and AlN), with reduced manufacturing cost, material loss, and increased productivity.

The aim of this project is expected to be accomplished by the following objectives:

1)        In-depth fundamental understanding of ultra-short pulsed laser radiation-induced amorphous layer generation mechanism.

2)        Investigations of the mechanism of ultrasonic field-induced crack propagation and branching in amorphous hard and/or brittle materials.

3)        A hybrid wafer separation approach and its testbed that can accommodate laser-induced modified layer generation and ultrasonic-enhanced fracturing.

4)        Evaluation and documentation of the effectiveness of the proposed approach.